← Back to Projects
SimulationCOMSOLThermal AnalysisMultiphysics

Thermal Simulation — CPU Heat Sink & Radial Fin Array

COMSOL multiphysics modelling of a CPU heat sink and radial fin array — systematically varying fin geometry to optimise heat dissipation through both stationary and transient thermal studies.

Thermal Simulation — CPU Heat Sink & Radial Fin Array
Coming Soon
Full case study in progress

A detailed breakdown of the brief, process, key engineering decisions, and outcomes will be added here shortly.

Get In Touch